Novel Optical Package Providing Efficient Coupling Between DFB-LD And Silicon PIC Edge Couplers With Low Return Loss

ABSTRACT

An optical package for providing efficient coupling between a photonic device and a silicon photonic integrated-circuit chip (Si PIC) edge couplers with low return loss, as well as variations thereof, is described. The optical package may include a photonic device, a Si PIC, a single mode fiber or fiber array assembly, a lens and a spacer. The Si PIC may an input edge coupler and an output edge coupler. The single mode fiber or fiber array assembly may be aligned to the output edge coupler. The lens may be disposed between the photonic device and the input edge coupler, and may be configured to minimize a mismatch between an output spot size of the photonic device and a spot size of the input edge coupler of the Si PIC. The spacer may be bonded to a facet of the input edge coupler with an index matching fluid.

CROSS-REFERENCE TO RELATED PATENT APPLICATION(S)

The present disclosure is a Continuation of U.S. patent application Ser.No. 15/143,019, filed on 29 Apr. 2016, which is a non-provisionalapplication of, and claims the priority benefit of, U.S. ProvisionalPatent Application No. 62/179,361, filed on 5 May 2015. The contents ofaforementioned applications are herein incorporated by reference intheir entirety.

TECHNICAL FIELD

The present disclosure is related to optical packages. Moreparticularly, the present disclosure is directed to an optical packagefor providing efficient coupling between a distributed feedback laserdiode and a silicon photonic integrated-circuit chip edge couplers withlow return loss.

BACKGROUND

Silicon photonic integrated circuits (Si PIC) have attracted tremendousattention due to their high-density integration capabilities of coupler,modulator, photodiode, avalanche photodiode, polarization diversitycomponents and multimode interferometers. However, link budgetdeficiency has limited the application of Si PIC. In one aspect, thecoupling efficiency of distributed feedback lasers (DFB-LD) and Si PIChas major influence on the link budget.

Up to the present time, there are two coupling structures adopted in SiPICs. The first coupling structure is grating coupler, which is favoredfor its on-chip characterizing compatibilities and high couplingefficiency with less than 2 dB insertion loss. However, one disadvantageof grating coupler is its limited spectral bandwidth, and the typicalbandwidth within 1 dB variation is less than 20 nm. Anotherless-apparent but significant disadvantage is that its verticalpackaging structure cannot be easily designed into QSFP28 form factorswhich have been the main stream packaging form factors in data centerapplications.

The second coupling structure is edge coupler, usually with an inversetapered silicon waveguide surrounded by a SiO₂ cantilever structure.Edge couplers are in-plane structures which can be fully compatible withQSFP form factors. Edge couplers may provide less than 2 dB insertionloss to single mode fiber. Edge couplers may also demonstrate couplingtolerance comparable with single mode fiber and very wide spectralbandwidth supporting O-band and C-band simultaneously. Nevertheless, thecoupling loss of a DFB-LD is still beyond the acceptable range, due tothe mismatch of DFB-LD mode size and edge coupler mode size. Lenses havebeen adopted to overcome the mismatch between two modes. However, mostcommercially available lenses are not designed for the coupling betweenDFB-LD and Si PIC edge coupler, as shown in FIG. 4, but are designed forcoupling between DFB-LD and single mode fiber. In FIG. 4, theconventional coupling scheme 400 simply utilizes a lens to couple anoutput optical beam into an edge coupler of a Si PIC. Thus, it is noteasy to find a suitable lens to optimize the coupling between DFB-LD andSi PIC edge coupler.

SUMMARY

The following summary is illustrative only and is not intended to belimiting in any way. That is, the following summary is provided tointroduce concepts, highlights, benefits and advantages of the novel andnon-obvious techniques described herein. Select implementations arefurther described below in the detailed description. Thus, the followingsummary is not intended to identify essential features of the claimedsubject matter, nor is it intended for use in determining the scope ofthe claimed subject matter.

The present disclosure aims to address aforementioned issues associatedwith conventional coupling structures. Advantageously, the presentdisclosure provides a novel high-efficient optical package thatoptimizes the coupling between DFB-LD and Si PIC edge coupler withsuppressed return loss.

In one aspect, an optical package may include a DFB-LD, a Si PIC, asingle mode fiber or fiber array assembly, a lens and a spacer. The SiPIC may include at least one input edge coupler and at least one outputedge coupler. The single mode fiber or fiber array assembly may bealigned to the at least output edge coupler of the Si PIC. The lens maybe disposed between the DFB-LD and the at least one input edge couplerof the Si PIC, and may be configured to minimize a mismatch between anoutput spot size of the DFB-LD and a spot size of the at least one inputedge coupler of the Si PIC. The spacer may be bonded to a facet of theat least one input edge coupler of the Si PIC with an index matchingfluid.

In another aspect, an optical package may include a DFB-LD, a Si PIC, asingle mode fiber or fiber array assembly, a lens and an isolator. TheSi PIC may include at least one input edge coupler and at least oneoutput edge coupler. The single mode fiber or fiber array assembly maybe aligned to the at least output edge coupler of the Si PIC. The lensmay be disposed between the DFB-LD and the at least one input edgecoupler of the Si PIC, and may be configured to minimize a mismatchbetween an output spot size of the DFB-LD and a spot size of the atleast one input edge coupler of the Si PIC. The isolator may be bondedto a facet of the at least one input edge coupler of the Si PIC with anindex matching fluid.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the present disclosure, and are incorporated in andconstitute a part of this specification. The drawings illustrateembodiments of the present disclosure and, together with thedescription, serve to explain the principles of the present disclosure.The drawings may not necessarily be in scale so as to better presentcertain features of the illustrated subject matter.

FIG. 1 is a diagram of a high-efficiency optical package in accordancewith an embodiment of the present disclosure.

FIG. 2 is a diagram of a high-efficiency optical package in accordancewith another embodiment of the present disclosure.

FIG. 3 is a diagram of a high-efficiency and low-return-loss opticalpackage in accordance with an embodiment of the present disclosure.

FIG. 4 is a diagram of a conventional coupling scheme in the prior art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Detailed embodiments of the claimed subject matters are disclosedherein. However, it shall be understood that the disclosed embodimentsare merely illustrative of the claimed subject matters which may beembodied in various forms. The present disclosure may, however, beembodied in many different forms and should not be construed as limitedto the exemplary embodiments set forth herein. Rather, these exemplaryembodiments are provided so that description of the present disclosureis thorough and complete and will fully convey the scope of the presentdisclosure to those skilled in the art. In the description below,details of well-known features and techniques may be omitted to avoidunnecessarily obscuring the presented embodiments.

The present disclosure provides various embodiments of a novelhigh-efficient optical package which optimizes the coupling betweenDFB-LD and Si PIC edge coupler with low return loss. In general, ahigh-efficient optical package in accordance with the present disclosuremay include a DFB-LD, a Si PIC, a lens, a single mode fiber or a fiberarray assembly, and a spacer or an isolator. The lens may be inserted orotherwise disposed between the DFB-LD and an input edge coupler of theSi PIC. The single mode fiber or fiber array assembly may be coupled toan output edge coupler of the Si PIC with an index matching fluid filledin an air gap therebetween. The spacer may be a silica double-polishedspacer bonded to a facet of the input edge coupler of the Si PIC withthe index matching fluid filling the air gap, as shown in FIG. 1. Thesilica spacer may be utilized as a container or adhesion surface forfilling the index matching fluid, thus allowing expansion of the modesize of the edge coupler. Furthermore, an opposite surface of the silicaspacer may be anti-reflection coated to help reduce return loss.

FIG. 1 illustrates a high-efficiency optical package 100 in accordancewith an embodiment of the present disclosure. Optical package 100 mayinclude a high-efficiency coupling structure between a DFB-LD 110 and aSi PIC 120. Si PIC 120 may have at least one input edge coupler 122 andat least one output edge coupler 124. A silica spacer (or isolator) 130may be bonded to a facet of the at least one input edge coupler 122 withan index matching fluid 140. A lens 150 may be inserted or otherwisedisposed between DFB-LD 110 and spacer or isolator 130. A single modefiber or fiber array assembly 160 may be aligned to the at least outputedge coupler 124 of the Si PIC 120. The single mode fiber or fiber arrayassembly 160 may be bonded to a facet of the at least one output edgecoupler 124 with the index matching fluid 140.

FIG. 2 illustrates a high-efficiency optical package 200 in accordancewith another embodiment of the present disclosure. Optical package 200may include a high-efficiency coupling structure between a DFB-LD 210and a Si PIC 220. Si PIC 220 may have at least one input edge coupler222 and at least one output edge coupler 224. A silica spacer (orisolator) 230 may be bonded to a facet of the at least one input edgecoupler 222 with an index matching fluid 240. The index matching fluid240 may be ultra-violet (UV) curable and/or UV cured. A gradient index(GRIN) lens 250 may be inserted or otherwise disposed between DFB-LD 210and spacer or isolator 230. A single mode fiber or fiber array assembly260 may be aligned to the at least output edge coupler 224 of the Si PIC220. The single mode fiber or fiber array assembly 260 may be bonded toa facet of the at least one output edge coupler 224 with the indexmatching fluid 240.

FIG. 3 illustrates a high-efficiency and low-return-loss optical package300 in accordance with an embodiment of the present disclosure. Opticalpackage 300 may include a high-efficiency coupling structure between aDFB-LD 310 and a Si PIC 320. Si PIC 320 may have at least one input edgecoupler 322 and at least one output edge coupler 324. A silica spacer(or isolator) 330 may be bonded to a facet of the at least one inputedge coupler 322 with an index matching fluid 340. The index matchingfluid 340 may be ultra-violet (UV) curable and/or UV cured. A lens 350may be inserted or otherwise disposed between DFB-LD 310 and spacer orisolator 330. A single mode fiber or fiber array assembly 360 may bealigned to the at least output edge coupler 324 of the Si PIC 320. Thesingle mode fiber or fiber array assembly 360 may be bonded to a facetof the at least one output edge coupler 324 with the index matchingfluid 340. A facet of the at least one input edge coupler 322 (e.g., thefacet facing the spacer or isolator 330) may be tilt-polished.Alternatively or additionally, a facet of the at least one output edgecoupler 324 (e.g., the facet facing the single mode fiber or fiber arrayassembly 360) may be tilt-polished. The Si PIC 320 may be covered withat least one silica cover lid 370.

In view of the above, select features of various embodiments inaccordance with the present disclosure are described below.

In one aspect, an optical package may include a DFB-LD, a Si PIC, asingle mode fiber or fiber array assembly, a lens and a spacer. The SiPIC may include at least one input edge coupler and at least one outputedge coupler. The single mode fiber or fiber array assembly may bealigned to the at least output edge coupler of the Si PIC. The lens maybe disposed between the DFB-LD and the at least one input edge couplerof the Si PIC, and may be configured to minimize a mismatch between anoutput spot size of the DFB-LD and a spot size of the at least one inputedge coupler of the Si PIC. The spacer may be bonded to a facet of theat least one input edge coupler of the Si PIC with an index matchingfluid.

In some embodiments, the spacer may include a silica spacer, a glassspacer, a polymer spacer, a polyimide spacer, an epoxy spacer, or aresin spacer.

In some embodiments, the spacer may include a double-side polishedspacer.

In some embodiments, a first surface of the spacer facing toward thelens may be coated with an anti-reflection film.

In some embodiments, the at least one input edge coupler may include acantilever structure edge coupler or an anchored-cantilever structureedge coupler.

In some embodiments, the optical package may also include at least onesilica cover lid. The Si PIC may be covered with the at least one silicacover lid. In some embodiments, the facet of the at least one input edgecoupler may be tilt-polished, as shown in FIG. 3. Alternatively oradditionally, a facet of the at least one output edge coupler may betilt-polished, as shown in FIG. 3.

In some embodiments, the lens may include a ball lens, an aspheric lens,a GRIN lens, or a set of collimator lenses.

In some embodiments, the single mode fiber may be fixed to a facet ofthe at least one output edge coupler with the index matching fluid.

In some embodiments, the DFB-LD may be configured to operate at awavelength range of C-band, O-band, or a combination thereof.

In some embodiments, the DFB-LD and the lens may be packaged as onepackaged component. In some embodiments, a type of the one packagedcomponent is a transistor outline can (TO-can) type or a butterfly type.

In some embodiments, the index matching fluid may be UV curable.

In some embodiments, the lens may include a GRIN lens, as shown in FIG.2. The GRIN lens may be bonded to a second surface of the spacer withUV-curable epoxy or resin.

In another aspect, an optical package may include a DFB-LD, a Si PIC, asingle mode fiber or fiber array assembly, a lens and an isolator. TheSi PIC may include at least one input edge coupler and at least oneoutput edge coupler. The single mode fiber or fiber array assembly maybe aligned to the at least output edge coupler of the Si PIC. The lensmay be disposed between the DFB-LD and the at least one input edgecoupler of the Si PIC, and may be configured to minimize a mismatchbetween an output spot size of the DFB-LD and a spot size of the atleast one input edge coupler of the Si PIC. The isolator may be bondedto a facet of the at least one input edge coupler of the Si PIC with anindex matching fluid.

In some embodiments, the isolator may include a double-side polishedisolator.

In some embodiments, a first surface of the isolator facing toward thelens may be coated with an anti-reflection film.

In some embodiments, the at least one input edge coupler may include acantilever structure edge coupler or an anchored-cantilever structureedge coupler.

In some embodiments, the optical package may also include at least onesilica cover lid. The Si PIC may be covered with the at least one silicacover lid. In some embodiments, the facet of the at least one input edgecoupler may be tilt-polished, as shown in FIG. 3. Alternatively oradditionally, a facet of the at least one output edge coupler may betilt-polished, as shown in FIG. 3.

In some embodiments, the lens may include a ball lens, an aspheric lens,a GRIN lens, or a set of collimator lenses.

In some embodiments, the single mode fiber may be fixed to a facet ofthe at least one output edge coupler with the index matching fluid.

In some embodiments, the DFB-LD may be configured to operate at awavelength range of C-band, O-band, or a combination thereof.

In some embodiments, the DFB-LD and the lens may be packaged as onepackaged component. In some embodiments, a type of the one packagedcomponent is a TO-can type or a butterfly type.

In some embodiments, the index matching fluid may be UV curable.

In some embodiments, the lens may include a GRIN lens, as shown in FIG.2. The GRIN lens may be bonded to a second surface of the isolator withUV-curable epoxy or resin.

Additional Notes

Although some embodiments are disclosed above, they are not intended tolimit the scope of the present disclosure. It will be apparent to thoseskilled in the art that various modifications and variations can be madeto the disclosed embodiments of the present disclosure without departingfrom the scope or spirit of the present disclosure. In view of theforegoing, the scope of the present disclosure shall be defined by thefollowing claims and their equivalents.

What is claimed is:
 1. An optical package, comprising: a photonicdevice; a silicon photonic integrated-circuit chip (Si PIC) comprisingat least one input edge coupler and at least one output edge coupler; asingle mode fiber or fiber array assembly aligned to the at least outputedge coupler of the Si PIC; a lens disposed between the photonic deviceand the at least one input edge coupler of the Si PIC, the lensconfigured to minimize a mismatch between an output spot size of thephotonic device and a spot size of the at least one input edge couplerof the Si PIC; and a spacer bonded to a facet of the at least one inputedge coupler of the Si PIC with an index matching fluid.
 2. The opticalpackage of claim 1, wherein the photonic device comprises a distributedfeedback laser diode (DFB-LD), a fiber, a fiber array unit, a siliconphotonic chip, a planar waveguide circuit chip, or a surface illuminatedphotodiode.
 3. The optical package of claim 1, wherein the spacercomprises a double-side polished spacer, a silica spacer, a glassspacer, a polymer spacer, a polyimide spacer, an epoxy spacer, or aresin spacer.
 4. The optical package of claim 1, wherein a first surfaceof the spacer facing toward the lens is coated with an anti-reflectionfilm.
 5. The optical package of claim 1, wherein the at least one inputedge coupler comprises a cantilever structure edge coupler or ananchored-cantilever structure edge coupler.
 6. The optical package ofclaim 1, further comprising: at least one silica cover lid, wherein theSi PIC is covered with the at least one silica cover lid.
 7. The opticalpackage of claim 1, wherein the facet of the at least one input edgecoupler is tilt-polished.
 8. The optical package of claim 1, wherein afacet of the at least one output edge coupler is tilt-polished.
 9. Theoptical package of claim 1, wherein the lens comprises a ball lens, anaspheric lens, a gradient index (GRIN) lens, or a set of collimatorlenses.
 10. The optical package of claim 1, wherein the single modefiber is fixed to a facet of the at least one output edge coupler withthe index matching fluid.
 11. The optical package of claim 1, whereinthe photonic device is configured to operate at a wavelength range ofC-band, O-band, or a combination thereof.
 12. The optical package ofclaim 1, wherein the photonic device and the lens are packaged as onepackaged component.
 13. The optical package of claim 12, wherein a typeof the one packaged component is a transistor outline can (TO-can) typeor a butterfly type.
 14. The optical package of claim 1, wherein theindex matching fluid is ultra-violet (UV) curable.
 15. The opticalpackage of claim 1, wherein the lens comprises a GRIN lens, and whereinthe GRIN lens is bonded to a second surface of the spacer withUV-curable epoxy or resin.
 16. An optical package, comprising: aphotonic device; a silicon photonic integrated-circuit chip (Si PIC)comprising at least one input edge coupler and at least one output edgecoupler; a single mode fiber or fiber array assembly aligned to the atleast output edge coupler of the Si PIC; a lens disposed between thephotonic device and the at least one input edge coupler of the Si PIC,the lens configured to minimize a mismatch between an output spot sizeof the photonic device and a spot size of the at least one input edgecoupler of the Si PIC; and an isolator bonded to a facet of the at leastone input edge coupler of the Si PIC with an index matching fluid,wherein the at least one input edge coupler comprises a cantileverstructure edge coupler or an anchored-cantilever structure edge coupler,and wherein the index matching fluid is ultra-violet (UV) curable. 17.The optical package of claim 16, further comprising: at least one silicacover lid, wherein the Si PIC is covered with the at least one silicacover lid, wherein the facet of the at least one input edge coupler istilt-polished, and wherein a facet of the at least one output edgecoupler is tilt-polished.
 18. The optical package of claim 16, whereinthe lens comprises a ball lens, an aspheric lens, a gradient index(GRIN) lens, or a set of collimator lenses.
 19. The optical package ofclaim 16, wherein the lens comprises a GRIN lens, and wherein the GRINlens is bonded to a second surface of the spacer with UV-curable epoxyor resin.
 20. The optical package of claim 16, wherein the photonicdevice comprises a distributed feedback laser diode (DFB-LD), whereinthe single mode fiber is fixed to a facet of the at least one outputedge coupler with the index matching fluid, wherein the DFB-LD isconfigured to operate at a wavelength range of C-band, O-band, or acombination thereof, wherein the DFB-LD and the lens are packaged as onepackaged component, and wherein a type of the one packaged component isa transistor outline can (TO-can) type or a butterfly type.